The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to ...

Singapore is investing heavily in AI, but its success hinges on equipping its workforce with the skills to effectively apply ...

As per a CNBC report, in 2025, significant changes are expected in global AI regulation, especially in the U.S., the EU, and ...

There's an appetite for AI, with Microsoft’s 2024 Work Trend Index finding that 88% of Singapore’s knowledge workers already ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

Are writers Luddites when they express concerns about generative artificial intelligence? Read more at straitstimes.com.

2025 is the year to move beyond experimentation and focus on what matters most: smart scaling, security, and trust.