Innodisk is showing a range of edge AI platforms at Embedded World 2026, spanning enterprise inference, industrial vision, ...
The C/C++test and C/C++test CT automated testing platforms from Parasoft provide software test automation for C and C++ ...
The CI-ONE integrated PA + SPDT modules from Circuits Integrated Hellas (CIH) are small-form-factor Ka-band RF front-end ...
Acromag has released the QMC730, a multifunction I/O module in the VITA 93 QMC small form factor (26×78.25mm) that combines ...
The VIAVI® ePRTC360+™ from VIAVI Solutions is a Cesium-less enhanced primary reference time clock designed to meet ITU-T ...
From user devices to base stations to the network core, AI will be written into all aspects of 6G. Combining that with Integrated Sensing and Communications should give 6G capabilities not found in ...
Ironwood Electronics has released a new 86GHz elastomer socket for QFN3 devices, using gold-plated embedded-wire elastomer ...
The QSiC™ Gen3 SiC modules from SemiQ Inc are silicon carbide power modules designed for compact and efficient active front ends and compressor systems used in advanced datacenter cooling ...
The Salience Labs 32-port all-optical circuit switch is an optical switching platform designed for AI data center networks, using photonic switching to connect GPUs across racks while reducing network ...
This article examines engineering concepts for transitioning from 12-V to 48-V power systems, with a particular emphasis on ...
The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 ...
Mobile World Congress 2026 in Barcelona brought together semiconductor vendors, wireless infrastructure companies, and test-and-measurement suppliers to present new hardware platforms, chipsets, and ...
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