Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...
Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...
In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer ...
A new technical paper titled “Interstellar: Fully Partitioned and Efficient Security Monitoring Hardware Near a Processor Core for Protecting Systems against Attacks on Privileged Software” was ...
A new technical paper titled “Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors” was published by researchers at Micron and Intel.
Alphawave Semi is positioned to pioneer this effort with an HBM4 memory controller portfolio and recently announced 3nm, 24 Gbps die-to-die UCIe IP subsystem delivering 1.6 TB/s of bandwidth. In ...
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...
Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.
An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...