GB300 'Blackwell Ultra' with 288GB HBM3E, increased 1.4kW power to be detailed, Rubin AI GPU details and CPO tech unveiling.

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

Nvidia (NASDAQ:NVDA) has had an underwhelming start to 2025, as the AI chip giant grapples with a mix of unfavorable macro ...

Comment With the exception of custom cloud silicon, like Google's TPUs or Amazon's Trainium ASICs, the vast majority of AI ...

NVIDIA's new B300 AI GPU will reportedly chow down on up to 1400W of power, with 1.5x the performance in FP4 performance on a single AI GPU over the B200 AI GPU. We can expect the HBM capacity of ...

including Nvidia. The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities.

SEOUL, March 12 (Yonhap) -- Chip giants Samsung Electronics Co. and SK hynix Inc. will showcase their latest advancements in ...

NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...

Big tech is tired of relying on Nvidia, so they're making their own chips OpenAI’s first AI GPU is nearly ready ... used systolic array architecture, HBM, and advanced networking capabilities.

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM ... on a GPU, and more capacity ...

Meta Accelerates AI Chip Development to Reduce Dependence on Nvidia Meta boosts semiconductor initiatives to build an ...