Off the bat, packaging for the RTX 5090 boasts a 50% reduction in size compared to the last generation to minimize material ...

As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Sony's next-generation PlayStation 6 console rumored to have AMD Zen 5 processor with X3D cache, new UDNA GPU architecture in ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Nvidia 's RTX 5090 Founders Edition GPU is almost here, promising to step performance up across the board from the previous generation's RTX 4090 - fortunately, we've got our hands on it with an early ...

"So it's not about reducing capacity. It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The card in question comes from an AIB partner known as Inno3D, which is one of the lesser-known GPU manufacturers. The packaging, obtained by VideoCardz, proclaims this to be the RTX 5090 iChill X3.

Meet the new flagship Nvidia graphics card, as we compare the cooler design to the RTX 4090, and look at the new packaging as ...

Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly ...

Hopper refers to Nvidia's GPU architecture platform before it announced ... its Blackwell chips as quickly as TSMC can make them but packaging has remained a bottleneck due to capacity constraints.