Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.
CFETs and buried power rails; agentic AI for EDA; 6G architecture decisions; chiplet connectivity.
Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...
As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and ...
Researchers at Georgia Institute of Technology published a technical paper titled “Low-loss ultra-compact photonic bends with enhanced fabrication tolerance for commercial foundry processes.” Abstract ...
Researchers at Seoul National University and Yonsei University published a technical paper titled “Monolithic three-dimensionally integrated memristor-thin-film transistor for electrically ...
Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...
Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a ...
Researchers at the University of California, Santa Cruz published a technical paper titled “Design Space Exploration of Backside Clock Meshes for 2 nm GAAFET BSPDN Technology.” Abstract Excerpt: ...
Vidya Darbari is Axiomise's chief strategy and operations officer, co-founder, and company director. A PhD from University of ...
Humanoid robots are rapidly transitioning from research demonstrations to commercial deployment in factories, warehouses, and ...
From the A7 logic technology node onwards, industry may likely transition to CFET-based transistor architectures which enable 4.5-track (4.5T) and below standard cells. Progress in CFET enablement is ...
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