Nvidia (NVDA) supplier SK Hynix (OTCPK:HXSCF) has won up to $458M in direct funding as part of the U.S. CHIPs Act to build a robust and resilient AI semiconductor supply chain in the U.S. The award comes after the previously signed preliminary memorandum ...

"US awards $458m to SK Hynix for chip packaging plant" was originally created and published by Verdict, a GlobalData owned brand.

The U.S. Commerce Department on Thursday finalized an award to SK Hynix of up to $458 million in government grants to help fund an advanced chip packaging plant and research and development facility for artificial intelligence products in Indiana.

Read about the $458M federal funding support for South Korean company SK Hynix’s upcoming advanced memory packaging plant in Indiana.

President Joe Biden's administration has finalized an award of up to $458 million for SK hynix, officials said Thursday, furthering efforts to lock in his legacy in boosting US semiconductor production before Donald Trump takes office.

The Biden administration has cemented a deal to give SK Hynix Inc. as much as $458 million in grants and $500 million in loans to support an advanced chip packaging facility in Indiana, a key part of US efforts to build a domestic semiconductor supply chain.

The United States has finalized a deal to give South Korean chipmaker SK Hynix up to $458 million in grants and $500 million in loans to build an advanced chip packaging facility in Indiana. The combined grant and loan subsidy package amounts to $958 million.

The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the AI supply chain in the US.

SK Hynix has secured a $458 million grant from the U.S. Commerce Department to fund an AI chip packaging plant in Indiana. The facility will produce next-generation memory chips for AI systems, filling a crucial gap in