SHENZHEN, GUANGDONG, CHINA, June 11, 2026 /EINPresswire.com/ — Reliability in printed circuit board assembly often hinges on the integrity of the solder joint ...
The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
Japanese storefront Shigezone has recently listed a USB PD (Power Delivery)-operated reflow oven. The top plate reaches a maximum temperature of 280 degrees Celsius at default settings or 350 degrees ...
In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake! There are a variety of methods for reflowing a ...
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