GB300 'Blackwell Ultra' with 288GB HBM3E, increased 1.4kW power to be detailed, Rubin AI GPU details and CPO tech unveiling.

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

Nvidia (NASDAQ:NVDA) has had an underwhelming start to 2025, as the AI chip giant grapples with a mix of unfavorable macro ...

NVIDIA's new B300 AI GPU will reportedly chow down on up to 1400W of power, with 1.5x the performance in FP4 performance on a single AI GPU over the B200 AI GPU. We can expect the HBM capacity of ...

New AI models from the likes of Google are showing that the technology can be run on fewer Nvidia chips. Will it cause ...

When it's all abstracted by an API endpoint, do you even care what's behind the curtain? Comment With the exception of custom ...

NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...

including Nvidia. The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities.

At GDC today Nvidia announced that "neural shading support will come to DirectX preview in April, unlocking the power of AI ...

Nvidia’s RTX 4060 has officially become the most widely used graphics card among gamers on Steam, thanks to its affordable ...